PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM2904ITP/NOPB
LM2904ITPX/NOPB
LM2904MX
DSBGA
DSBGA
SOIC
YPB
YPB
D
8
8
8
8
8
8
8
8
8
8
250
3000
2500
2500
2500
2500
2500
2500
250
210.0
210.0
367.0
367.0
367.0
367.0
367.0
367.0
210.0
210.0
185.0
185.0
367.0
367.0
367.0
367.0
367.0
367.0
185.0
185.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
LM2904MX/NOPB
LM358AMX
SOIC
D
SOIC
D
LM358AMX/NOPB
LM358MX
SOIC
D
SOIC
D
LM358MX/NOPB
LM358TP/NOPB
LM358TPX/NOPB
SOIC
D
DSBGA
DSBGA
YPB
YPB
3000
Pack Materials-Page 2