PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
LM393PW
LM393PWE4
LM393PWG4
LM393PWLE
LM393PWR
LM393PWRE4
LM393PWRG3
LM393PWRG4
M38510/11202BPA
Status
(1)
Package Type Package Pins Package
Drawing
Qty
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
CDIP
PW
PW
PW
PW
PW
PW
PW
PW
JG
8
8
8
8
8
8
8
8
8
2000
2000
2000
2000
1
150
150
150
Eco Plan
(2)
Lead/Ball Finish
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
CU NIPDAU
CU NIPDAU
CU SN
CU NIPDAU
A42
MSL Peak Temp
(3)
Op Temp (°C)
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
-55 to 125
Top-Side Markings
(4)
Samples
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
L393
L393
L393
L393
L393
L393
L393
JM38510
/11202BPA
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
for the latest availability
information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 6
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