SNVS288I – SEPTEMBER 2004 – REVISED APRIIL 2013
Absolute Maximum Ratings
(1) (2)
V
IN
SW Voltage
Boost Voltage
Boost to SW Voltage
FB Voltage
EN Voltage
Junction Temperature
ESD Susceptibility
(3)
Storage Temp. Range
Soldering Information Reflow Peak Pkg. Temp.(15sec)
(1)
(2)
(3)
-0.5V to 24V
-0.5V to 24V
-0.5V to 30V
-0.5V to 6.0V
-0.5V to 3.0V
-0.5V to (V
IN
+ 0.3V)
150°C
2kV
-65°C to 150°C
260°C
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For specific specifications and the test conditions,
see Electrical Characteristics.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Human body model, 1.5kΩ in series with 100pF.
Operating Ratings
(1)
V
IN
SW Voltage
Boost Voltage
Boost to SW Voltage
Junction Temperature Range
Thermal Resistance
θ
JA (2)
(1)
(2)
3V to 20V
-0.5V to 20V
-0.5V to 25V
1.6V to 5.5V
−40°C
to +125°C
118°C/W
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For specific specifications and the test conditions,
see Electrical Characteristics.
Thermal shutdown will occur if the junction temperature exceeds 165°C. The maximum power dissipation is a function of T
J(MAX)
,
θ
JA
and T
A
. The maximum allowable power dissipation at any ambient temperature is P
D
= (T
J(MAX)
– T
A
)/θ
JA
. All numbers apply for
packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air. For a 2 layer board using 1 oz. copper in still
air,
θ
JA
= 204°C/W.
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