LM2676EP Enhanced Plastic
Note 7:
All limits are guaranteed at room temperature (standard type face) and at
temperature extremes (bold type face).
All room temperature limits are 100%
tested during production with T
A
= T
J
= 25°C. All limits at temperature extremes are guaranteed via correlation using standard standard Quality Control (SQC)
methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
Note 8:
Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads in a socket, or on a
PC board with minimum copper area.
Note 9:
Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads soldered to a PC
board containing approximately 4 square inches of (1 oz.) copper area surrounding the leads.
Note 10:
Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board area of 0.136 square inches (the same size as
the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
Note 11:
Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board area of 0.4896 square inches (3.6 times the area
of the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
Note 12:
Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square inches (7.4 times
the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal resistance further. See the thermal model in Switchers
Made Simple
®
software.
Note 13:
Junction to ambient thermal resistance for the 14-lead LLP mounted on a PC board copper area equal to the die attach paddle.
Note 14:
Junction to ambient thermal resistance for the 14-lead LLP mounted on a PC board copper area using 12 vias to a second layer of copper equal to die
attach paddle. Additional copper area will reduce thermal resistance further. For layout recommendations, refer to Application Note AN-1187.
5
200996 Version 2 Revision 3
Print Date/Time: 2011/03/24 16:39:24
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