SNVS031J – APRIL 2000 – REVISED APRIL 2013
All Output Voltage Versions
Electrical Characteristics
Limits appearing in
bold type face
apply over the entire junction temperature range of operation,
−40°C
to 125°C.
Specifications appearing in normal type apply for T
A
= T
J
= 25°C. Unless otherwise specified V
IN
=12V for the 3.3V, 5V and
Adjustable versions and V
IN
=24V for the 12V version.
Symbol
I
Q
Parameter
Quiescent Current
V
FEEDBACK
= 8V
For 3.3V, 5.0V, and ADJ Versions
V
FEEDBACK
= 15V
For 12V Versions
I
STBY
I
CL
I
L
Standby Quiescent ON/OFF Pin = 0V
Current
Current Limit
Output Leakage
Current
Switch On-
Resistance
Oscillator
Frequency
Duty Cycle
Feedback Bias
Current
ON/OFF Threshold
Voltage
ON/OFF Input
Current
Thermal
Resistance
ON/OFF Input = 0V
NDZ Package, Junction to Ambient
(1)
NDZ Package, Junction to Ambient
NDZ Package, Junction to Case
KTW Package, Junction to Ambient
KTW Package, Junction to Ambient
KTW Package, Junction to Case
NHM Package, Junction to Ambient
(6)
NHM Package, Junction to Ambient
(7)
(3)
(4)
(2)
Conditions
Typ
4.2
Min
Max
6
Units
mA
DEVICE PARAMETERS
50
4.5
3.8/3.6
100/150
5.25/5.4
200
15
0.17/0.29
225
280
μA
A
μA
mA
Ω
kHz
%
%
nA
V
IN
= 40V, ON/OFF Pin = 0V
V
SWITCH
= 0V
V
SWITCH
=
−1V
I
SWITCH
= 3A
Measured at Switch Pin
Maximum Duty Cycle
Minimum Duty Cycle
V
FEEDBACK
= 1.3V
ADJ Version Only
16
0.15
260
91
0
85
1.4
20
65
45
2
56
35
26
2
55
29
0.8
R
DS(ON)
f
O
D
I
BIAS
V
ON/OFF
I
ON/OFF
θ
JA
θ
JA
θ
JC
θ
JA
θ
JA
θ
JA
θ
JC
θ
JA
θ
JA
(1)
(2)
(3)
(4)
(5)
(6)
(7)
2.0
45
V
μA
°C/W
KTW Package, Junction to Ambient
(5)
++
°C/W
Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads in a
socket, or on a PC board with minimum copper area.
Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads
soldered to a PC board containing approximately 4 square inches of (1 oz.) copper area surrounding the leads.
Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board area of 0.136 square inches (the
same size as the DDPAK package) of 1 oz. (0.0014 in. thick) copper.
Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board area of 0.4896 square inches
(3.6 times the area of the DDPAK package) of 1 oz. (0.0014 in. thick) copper.
Junction to ambient thermal resistance for the 7 lead DDPAK mounted horizontally against a PC board copper area of 1.0064 square
inches (7.4 times the area of the DDPAK package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal
resistance further. See the thermal model in Switchers Made Simple
®
software.
Junction to ambient thermal resistance for the 14-lead VSON mounted on a PC board copper area equal to the die attach paddle.
Junction to ambient thermal resistance for the 14-lead VSON mounted on a PC board copper area using 12 vias to a second layer of
copper equal to die attach paddle. Additional copper area will reduce thermal resistance further. For layout recommendations, refer to
Application Note AN-1187 at
4
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