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LM2674M-5.0/NOPB 参数 Datasheet PDF下载

LM2674M-5.0/NOPB图片预览
型号: LM2674M-5.0/NOPB
PDF下载: 下载PDF文件 查看货源
内容描述: LM2674 SIMPLE SWITCHER®电源转换器高效率500毫安降压型稳压器 [LM2674 SIMPLE SWITCHER® Power Converter High Efficiency 500 mA Step-Down Voltage Regulator]
分类和应用: 转换器稳压器开关光电二极管
文件页数/大小: 32 页 / 1570 K
品牌: TI [ TEXAS INSTRUMENTS ]
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SNVS007F – SEPTEMBER 1998 – REVISED APRIL 2013
All Output Voltage Versions
Specifications with standard type face are for T
J
= 25°C, and those with
bold type face
apply over
full Operating
Temperature Range.
Unless otherwise specified, V
IN
= 12V for the 3.3V, 5V, and Adjustable versions and V
IN
= 24V for the
12V version, and I
LOAD
= 100 mA.
Symbol
I
Q
Parameters
Quiescent Current
Conditions
V
FEEDBACK
= 8V
For 3.3V, 5.0V, and ADJ Versions
V
FEEDBACK
= 15V
For 12V Versions
I
STBY
I
CL
I
L
Standby Quiescent Current
Current Limit
Output Leakage Current
V
IN
= 40V, ON/OFF Pin = 0V
V
SWITCH
= 0V
V
SWITCH
=
−1V,
ON/OFF Pin = 0V
R
DS(ON)
f
O
D
I
BIAS
V
S/D
I
S/D
θ
JA
Switch On-Resistance
Oscillator Frequency
Maximum Duty Cycle
Minimum Duty Cycle
Feedback Bias
Current
ON/OFF Pin
Voltage Theshold
ON/OFF Pin Current
Thermal Resistance
V
FEEDBACK
= 1.3V
ADJ Version Only
Turn-On Threshold, Rising
(1)
ON/OFF Pin = 0V
P Package, Junction to Ambient
(2)
D Package, Junction to Ambient
(2)
I
SWITCH
= 500 mA
Measured at Switch Pin
ON/OFF Pin = 0V
Typ
Min
Max
Units
DEVICE PARAMETERS
2.5
2.5
50
0.8
1
6
0.25
260
95
0
85
1.4
20
95
105
0.8
7
2.0
37
225
0.62/0.575
100/150
1.2/1.25
25
15
0.40/0.60
275
3.6
mA
mA
μA
A
μA
mA
Ω
kHz
%
%
nA
V
μA
°C/W
(1)
(2)
The ON/OFF pin is internally pulled up to 7V and can be left floating for always-on operation.
Junction to ambient thermal resistance with approximately 1 square inch of printed circuit board copper surrounding the leads. Additional
copper area will lower thermal resistance further. See
section in the application note accompanying this
datasheet and the thermal model in
LM267X Made Simple
(version 6.0) software. The value
θ
J−A
for the WSON (NHN) package is
specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance
and power dissipation for the WSON package, refer to
Copyright © 1998–2013, Texas Instruments Incorporated
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