PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM2674LD-3.3/NOPB
LM2674LD-ADJ
WSON
WSON
WSON
WSON
WSON
SOIC
NHN
NHN
NHN
NHN
NHN
D
16
16
16
16
16
8
1000
1000
1000
4500
4500
2500
2500
2500
2500
2500
213.0
210.0
213.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
191.0
185.0
191.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
55.0
35.0
55.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
LM2674LD-ADJ/NOPB
LM2674LDX-5.0
LM2674LDX-5.0/NOPB
LM2674MX-12
LM2674MX-12/NOPB
LM2674MX-3.3/NOPB
LM2674MX-5.0/NOPB
LM2674MX-ADJ/NOPB
SOIC
D
8
SOIC
D
8
SOIC
D
8
SOIC
D
8
Pack Materials-Page 2