LM2674
SNVS007F –SEPTEMBER 1998–REVISED APRIL 2013
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Layout is very important in switching regulator designs. Rapidly switching currents associated with wiring
inductance can generate voltage transients which can cause problems. For minimal inductance and ground
loops, the wires indicated by heavy lines (in Figure 22 and Figure 23) should be wide printed circuit traces
and should be kept as short as possible. For best results, external components should be located as close to
the switcher IC as possible using ground plane construction or single point grounding.
If open core inductors are used, special care must be taken as to the location and positioning of this type of
inductor. Allowing the inductor flux to intersect sensitive feedback, IC ground path, and COUT wiring can cause
problems.
When using the adjustable version, special care must be taken as to the location of the feedback resistors and
the associated wiring. Physically locate both resistors near the IC, and route the wiring away from the inductor,
especially an open core type of inductor.
WSON Package Devices
The LM2674 is offered in the 16 lead WSON surface mount package to allow for increased power dissipation
compared to the SOIC-8 and PDIP.
The Die Attach Pad (DAP) can and should be connected to PCB Ground plane/island. For CAD and assembly
guidelines
refer
to
Application
Note
AN-1187
at
http://www.ti.com/lsds/ti/analog/powermanagement/power_portal.page.
22
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