PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM2672LD-ADJ/NOPB
LM2672MX-12/NOPB
LM2672MX-3.3
WSON
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
NHN
D
16
8
1000
2500
2500
2500
2500
2500
2500
2500
213.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
191.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
55.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
D
8
LM2672MX-3.3/NOPB
LM2672MX-5.0
D
8
D
8
LM2672MX-5.0/NOPB
LM2672MX-ADJ
D
8
D
8
LM2672MX-ADJ/NOPB
D
8
Pack Materials-Page 2