LM26420, LM26420-Q0, LM26420-Q1
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SNVS579J –FEBRUARY 2009–REVISED SEPTEMBER 2015
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.5
–0.5
–0.5
–0.5
MAX
7
UNIT
VIN
Input voltages
FB
3
V
EN
SW
7
Output voltages
7
V
Infrared or convection reflow (15 sec) Soldering Information
Storage temperature Tstg
220
150
°C
°C
–65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings (LM26420X/Y)
VALUE
±2000
±750
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 ESD Ratings (Automotive-LM26420-Q0/Q1)
VALUE
UNIT
Human-body model (HBM), per AEC Q100-002(1)
±2000
±750
Other pins
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per AEC Q100-
011
Corner pins 1, 10, 11, and
20
±750
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.4 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
MIN
3
NOM
MAX
5.5
UNIT
VIN
V
Junction temperature (Q1)
Junction temperature (Q0)
–40
–40
125
150
°C
6.5 Thermal Information
LM26420
LM26420
THERMAL METRIC(1)
PWP (HTSSOP) RUM (WQFN)
UNIT
20 PINS
35
16 PINS
40
RθJA
RθJC
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
°C/W
°C/W
3.9
6.8
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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