SNOS658D – JUNE 1999 – REVISED APRIL 2013
Electrical Characteristics—LM1577-ADJ, LM2577-ADJ (continued)
Specifications with standard type face are for T
J
= 25°C, and those in
bold type face
apply over full
Operating Temperature
Range.
Unless otherwise specified, V
IN
= 5V, V
FEEDBACK
= V
REF
, and I
SWITCH
= 0.
Symbol
Parameter
Error Amp
Output Current
Conditions
V
FEEDBACK
= 1.0V to 1.5V
V
COMP
= 1.0V
Typical
±200
±130/±90
±300/±400
I
SS
Soft Start Current
V
FEEDBACK
= 1.0V
V
COMP
= 0V
5.0
2.5/1.5
7.5/9.5
D
Maximum Duty Cycle
V
COMP
= 1.5V
I
SWITCH
= 100 mA
95
93/90
12.5
V
SWITCH
= 65V
V
FEEDBACK
= 1.5V (Switch Off)
I
SWITCH
= 2.0A
V
COMP
= 2.0V (Max Duty Cycle)
V
COMP
= 2.0V
10
300/600
0.5
0.7/0.9
4.3
3.7/3.0
5.3/6.0
THERMAL PARAMETERS (All Versions)
θ
JA
θ
JC
θ
JA
θ
JC
θ
JA
θ
JA
θ
JA
(6)
(7)
Thermal Resistance
K Package, Junction to Ambient
K Package, Junction to Case
T Package, Junction to Ambient
T Package, Junction to Case
N Package, Junction to Ambient
M Package, Junction to Ambient
S Package, Junction to Ambient
(6)
(6)
(7)
LM1577-ADJ
Limit
(1) (2)
LM2577-ADJ
Limit
(3)
±130/±90
±300/±400
2.5/1.5
7.5/9.5
93/90
Units
(Limits)
μA
μA(min)
μA(max)
μA
μA(min)
μA(max)
%
%(min)
A/V
μA
ΔI
SWITCH
/ΔV
C
Switch
Transconductance
OMP
I
L
V
SAT
Switch Leakage
Current
Switch Saturation
Voltage
NPN Switch
Current Limit
300/600
0.7/0.9
3.7/3.0
5.3/6.0
μA(max)
V
V(max)
A
A(min)
A(max)
35
1.5
65
2
85
100
37
°C/W
Junction to ambient thermal resistance with approximately 1 square inch of pc board copper surrounding the leads. Additional copper
area will lower thermal resistance further. See thermal model in “Switchers Made Simple” software.
If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper area thermally
connected to the package. Using 0.5 square inches of copper area,
θ
JA
is 50°C/W; with 1 square inch of copper area,
θ
JA
is 37°C/W;
and with 1.6 or more square inches of copper area,
θ
JA
is 32°C/W.
8
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