SNVS107C – JUNE 1999 – REVISED APRIL 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
(Circuit of
and
Maximum Power Dissipation
(DDPAK/TO-263)
Switching Waveforms
If the DDPAK/TO-263 package is used, the thermal resistance can be
reduced by increasing the PC board copper area thermally connected
to the package. Using 0.5 square inches of copper area,
θ
JA
is
50°C/W, with 1 square inch of copper area,
θ
JA
is 37°C/W, and with
1.6 or more square inches of copper area,
θ
JA
is 32°C/W.
Figure 18.
V
OUT
= 15V
A: Output Pin Voltage, 50V/div
B: Output Pin Current, 2A/div
C: Inductor Current, 2A/div
D: Output Ripple Voltage, 50 mV/div,
AC-Coupled
Horizontal Time Base: 5
μs/div
Figure 19.
Load Transient Response
Figure 20.
10
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