LM2576, LM2576HV
SNVS107C –JUNE 1999–REVISED APRIL 2013
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
(Circuit of Figure 21 and Figure 22)
Maximum Power Dissipation
(DDPAK/TO-263)
Switching Waveforms
VOUT = 15V
If the DDPAK/TO-263 package is used, the thermal resistance can be
reduced by increasing the PC board copper area thermally connected
to the package. Using 0.5 square inches of copper area, θJA is
50°C/W, with 1 square inch of copper area, θJA is 37°C/W, and with
1.6 or more square inches of copper area, θJA is 32°C/W.
A: Output Pin Voltage, 50V/div
B: Output Pin Current, 2A/div
C: Inductor Current, 2A/div
D: Output Ripple Voltage, 50 mV/div,
AC-Coupled
Horizontal Time Base: 5 μs/div
Figure 18.
Figure 19.
Load Transient Response
Figure 20.
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