SNVS106E – MAY 1999 – REVISED APRIL 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
(Circuit
and
Feedback Pin Current
Maximum Power Dissipation
(TO-263) (See
(1)
)
Figure 21.
Switching Waveforms
Figure 22.
Load Transient Response
V
OUT
= 5V
A: Output Pin Voltage, 10V/div
B: Output Pin Current, 1A/div
C: Inductor Current, 0.5A/div
D: Output Ripple Voltage, 20 mV/div,
AC-Coupled
Horizontal Time Base: 5
μs/div
Figure 23.
(1)
Figure 24.
If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper area thermally
connected to the package: Using 0.5 square inches of copper area,
θ
JA
is 50°C/W; with 1 square inch of copper area,
θ
JA
is 37°C/W;
and with 1.6 or more square inches of copper area,
θ
JA
is 32°C/W.
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