PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM2575HVMX-5.0
SOIC
DW
DW
KTT
24
24
5
1000
1000
500
330.0
330.0
330.0
24.4
24.4
24.4
10.8
10.8
15.9
15.9
3.2
3.2
5.0
12.0
12.0
16.0
24.0
24.0
24.0
Q1
Q1
Q2
LM2575HVMX-5.0/NOPB SOIC
LM2575HVSX-15
DDPAK/
TO-263
10.75 14.85
10.75 14.85
10.75 14.85
10.75 14.85
10.75 14.85
10.75 14.85
10.75 14.85
10.75 14.85
LM2575HVSX-15/NOPB DDPAK/
TO-263
KTT
KTT
KTT
KTT
KTT
KTT
KTT
5
5
5
5
5
5
5
500
500
500
500
500
500
500
330.0
330.0
330.0
330.0
330.0
330.0
330.0
24.4
24.4
24.4
24.4
24.4
24.4
24.4
5.0
5.0
5.0
5.0
5.0
5.0
5.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
24.0
24.0
24.0
24.0
24.0
24.0
24.0
Q2
Q2
Q2
Q2
Q2
Q2
Q2
LM2575HVSX-3.3
DDPAK/
TO-263
LM2575HVSX-3.3/NOPB DDPAK/
TO-263
LM2575HVSX-5.0
DDPAK/
TO-263
LM2575HVSX-5.0/NOPB DDPAK/
TO-263
LM2575HVSX-ADJ
DDPAK/
TO-263
LM2575HVSX-ADJ/NOPB DDPAK/
TO-263
LM2575MX-5.0
SOIC
SOIC
DW
DW
24
24
1000
1000
330.0
330.0
24.4
24.4
10.8
10.8
15.9
15.9
3.2
3.2
12.0
12.0
24.0
24.0
Q1
Q1
LM2575MX-5.0/NOPB
Pack Materials-Page 1