LM1575, LM2575-N, LM2575HV
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SNVS106E –MAY 1999–REVISED APRIL 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
(Circuit Figure 25 and Figure 26)
Maximum Power Dissipation
(1)
Feedback Pin Current
(TO-263) (See
)
Figure 21.
Figure 22.
Load Transient Response
Switching Waveforms
VOUT = 5V
A: Output Pin Voltage, 10V/div
B: Output Pin Current, 1A/div
C: Inductor Current, 0.5A/div
D: Output Ripple Voltage, 20 mV/div,
AC-Coupled
Horizontal Time Base: 5 μs/div
Figure 23.
Figure 24.
(1) If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper area thermally
connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is 37°C/W;
and with 1.6 or more square inches of copper area, θJA is 32°C/W.
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