LM111, LM211, LM311, LM311Y
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007A – SEPTEMBER 1973 – REVISED FEBRUARY 1992
LM311Y chip information
This chip, when properly assembled, displays characteristics similar to the LM311. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(1)
(8)
(5)
BALANCE
(7)
IN+
(2)
+
(3)
(6)
(4)
–
VCC+
(8)
COL
OUT
(7)
(2)
IN–
BAL/STRB
62
(1)
VCC – EMIT
OUT
(3)
CHIP THICKNESS: 15 TYPICAL
(4)
(5)
50
(6)
BONDING PADS: 4
×
4 MINIMUM
TJ max = 150°C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
3
TI [ TEXAS INSTRUMENTS ]
