PACKAGE OPTION ADDENDUM
www.ti.com
25-Feb-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
LCCC
CDIP
CDIP
SOIC
Drawing
JM38510/10304BPA
LM111FKB
LM111JG
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
JG
8
20
8
1
1
None
None
None
None
A42 SNPB
Level-NC-NC-NC
FK
POST-PLATE Level-NC-NC-NC
JG
1
A42 SNPB
A42 SNPB
Level-NC-NC-NC
Level-NC-NC-NC
LM111JGB
LM211D
JG
8
1
D
8
75
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
LM211DR
LM211P
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
PDIP
D
P
8
8
8
8
8
8
8
8
8
8
8
2500
50
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU Level-1-250C-UNLIM
LM211PW
LM211PWR
LM211QD
LM211QDR
LM311D
TSSOP
TSSOP
SOIC
SOIC
SOIC
SOIC
PDIP
PW
PW
D
150
2000
75
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
D
2500
75
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
D
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
LM311DR
LM311P
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
P
50
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
LM311PSR
LM311PW
SO
PS
PW
2000
150
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
TSSOP
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
LM311PWLE
LM311PWR
OBSOLETE TSSOP
ACTIVE TSSOP
PW
PW
8
8
None
Call TI
Call TI
2000
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
LM311Y
OBSOLETE XCEPT
Y
0
None
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
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