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LM1881N-X/NOPB 参数 Datasheet PDF下载

LM1881N-X/NOPB图片预览
型号: LM1881N-X/NOPB
PDF下载: 下载PDF文件 查看货源
内容描述: [SYNC SEPARATOR IC, PDIP8, PLASTIC, DIP-8]
分类和应用:
文件页数/大小: 18 页 / 1117 K
品牌: TI [ TEXAS INSTRUMENTS ]
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PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
LM1881M  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
0 to 70  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
D
8
8
8
8
95  
TBD  
Call TI  
CU SN  
Call TI  
CU SN  
Call TI  
LM  
1881M  
LM1881M/NOPB  
LM1881MX  
ACTIVE  
ACTIVE  
ACTIVE  
D
D
D
95  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
Call TI  
0 to 70  
LM  
1881M  
2500  
2500  
TBD  
0 to 70  
LM  
1881M  
LM1881MX/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
0 to 70  
LM  
1881M  
LM1881N  
ACTIVE  
ACTIVE  
PDIP  
PDIP  
P
P
8
8
40  
40  
TBD  
Call TI  
SN  
Call TI  
0 to 70  
0 to 70  
LM1881N  
LM1881N/NOPB  
Green (RoHS  
& no Sb/Br)  
Level-1-NA-UNLIM  
LM1881N  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
Addendum-Page 1  
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