PACKAGE OPTION ADDENDUM
www.ti.com
27-Jul-2013
PACKAGING INFORMATION
Orderable Device
LM1458M
LM1458M/NOPB
LM1458MX
LM1458MX/NOPB
LM1458N
LM1458N/NOPB
LM1558H
LM1558H/NOPB
MC1458CP1
MC1458P1
MC1558G
(1)
Status
(1)
Package Type Package Pins Package
Drawing
Qty
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
TO-99
TO-99
PDIP
PDIP
TO-99
D
D
D
D
P
P
LMC
LMC
P
P
LMC
8
8
8
8
8
8
8
8
8
8
8
95
95
2500
2500
40
40
500
500
40
40
500
Eco Plan
(2)
Lead/Ball Finish
Call TI
CU SN
Call TI
CU SN
Call TI
CU SN
Call TI
POST-PLATE
Call TI
Call TI
Call TI
MSL Peak Temp
(3)
Op Temp (°C)
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
-55 to 125
-55 to 125
0 to 70
0 to 70
-55 to 125
Device Marking
(4/5)
Samples
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TBD
Green (RoHS
& no Sb/Br)
TBD
Green (RoHS
& no Sb/Br)
TBD
Green (RoHS
& no Sb/Br)
TBD
Green (RoHS
& no Sb/Br)
TBD
TBD
TBD
Call TI
Level-1-260C-UNLIM
Call TI
Level-1-260C-UNLIM
Call TI
Level-1-NA-UNLIM
Call TI
Level-1-NA-UNLIM
Call TI
Call TI
Call TI
LM
1458M
LM
1458M
LM
1458M
LM
1458M
LM1458N
LM1458N
LM1558H
LM1558H
LM1458N
LM1458N
LM1558H
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
for the latest availability
information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 1
TI [ TEXAS INSTRUMENTS ]
