LM1117-N
SNOS412L –MAY 2004–REVISED JULY 2012
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Table 1. θJA Different Heatsink Area (continued)
Layout
15
Copper Area
Thermal Resistance
0.392
0.5
0.392
0.5
75
70
55
53
16
Figure 14. θJA vs. 1oz Copper Area for SOT-223
Figure 15. θJA vs. 2oz Copper Area for TO-252
Figure 16. Maximum Allowable Power Dissipation
vs. Ambient Temperature for SOT-223
Figure 17. Maximum Allowable Power Dissipation
vs. Ambient Temperature for TO-252
Figure 18. Maximum Allowable Power Dissipation
vs. 1oz Copper Area for SOT-223
Figure 19. Maximum Allowable Power Dissipation
vs. 2oz Copper Area for TO-252
14
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