SNOS412M – FEBRUARY 2000 – REVISED MARCH 2013
Figure 6. DDPAK/TO-263 Side View
ADJ/GND
1
8
NOT CONNECTED
V
IN
V
IN
V
IN
2
V
OUT
3
7
V
OUT
V
OUT
V
OUT
6
4
5
When using the WSON package
Pins 2, 3 & 4 must be connected together and
Pins 5, 6 & 7 must be connected together
Figure 7. WSON Top View
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1) (2)
Maximum Input Voltage (V
IN
to GND)
Power Dissipation
(3)
20V
Internally Limited
150°C
-65°C to 150°C
TO-220 (T) Package
SOT-223 (IMP) Package
260°C, 10 sec
260°C, 4 sec
2000V
Junction Temperature (T
J
)
(3)
Storage Temperature Range
Lead Temperature
ESD Tolerance
(1)
(2)
(3)
(4)
(4)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
The maximum power dissipation is a function of T
J(max)
,
θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(max)
–T
A
)/θ
JA
. All numbers apply for packages soldered directly into a PC board.
For testing purposes, ESD was applied using human body model, 1.5kΩ in series with 100pF.
OPERATING RATINGS
(1)
Input Voltage (V
IN
to GND)
Junction Temperature Range (T
J
)
(2)
(1)
(2)
LM1117-N
LM1117I
15V
0°C to 125°C
−40°C
to 125°C
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
The maximum power dissipation is a function of T
J(max)
,
θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(max)
–T
A
)/θ
JA
. All numbers apply for packages soldered directly into a PC board.
Copyright © 2000–2013, Texas Instruments Incorporated
3
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