SNVS037F – SEPTEMBER 1999 – REVISED MARCH 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2)
Maximum Input to Output Voltage Differential
LM1084-ADJ
LM1084-12
LM1084-3.3
LM1084-5.0
Power Dissipation
(3)
29V
18V
27V
25V
Internally Limited
150°C
-65°C to 150°C
260°C, to 10 sec
2000V
Junction Temperature (T
J
)
(4)
Storage Temperature Range
Lead Temperature
ESD Tolerance
(1)
(2)
(3)
(4)
(5)
(5)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
Power dissipation is kept in a safe range by current limiting circuitry. Refer to Overload Recovery in Application Notes.
The maximum power dissipation is a function of T
J(max)
,
θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(max)
–T
A
)/θ
JA
. All numbers apply for packages soldered directly into a PC board. Refer to
in the
For testing purposes, ESD was applied using human body model, 1.5kΩ in series with 100pF.
Operating Ratings
(1)
Junction Temperature Range (T
J
)
Control Section
Output Section
(1)
(2)
(2)
−40°C
to 125°C
−40°C
to 150°C
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
The maximum power dissipation is a function of T
J(max)
,
θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(max)
–T
A
)/θ
JA
. All numbers apply for packages soldered directly into a PC board. Refer to
in the
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