PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
LCCC
CDIP
CFP
Drawing
5962-8771101EA
76042012A
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
J
FK
J
16
20
16
16
20
16
16
16
16
16
1
1
None
None
None
None
None
None
None
None
None
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Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
7604201EA
1
7604201FA
W
FK
J
1
JM38510/31402B2A
JM38510/31402BEA
JM38510/31402BFA
SN54221J
LCCC
CDIP
CFP
1
1
W
J
1
CDIP
CDIP
PDIP
1
SN54LS221J
J
1
SN74221N
N
25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74LS221D
SN74LS221DBR
SN74LS221DR
SN74LS221N
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SSOP
SOIC
PDIP
D
DB
D
16
16
16
16
40
2000
2500
25
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
N
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74LS221N3
OBSOLETE
ACTIVE
PDIP
SO
N
16
16
None
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SN74LS221NSR
NS
2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SNJ54221J
SNJ54LS221FK
SNJ54LS221J
SNJ54LS221W
ACTIVE
ACTIVE
ACTIVE
ACTIVE
CDIP
LCCC
CDIP
CFP
J
FK
J
16
20
16
16
1
1
1
1
None
None
None
None
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Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
Addendum-Page 1