SLLSEB6B – JULY 2012 – REVISED MAY 2013
(1) (2)
ABSOLUTE MAXIMUM RATINGS
VALUES
MIN
VCC1, VCC2
Supply voltage
SDA1, SCL1
SDA2, SCL2
Output current
SDA1, SCL1
SDA2, SCL2
Human Body Model
Electrostatic
Discharge
Field-Induced-Charged
Device Model
Machine Model
T
J(MAX)
T
STG
(1)
Storage temperature range
ESDA, JEDEC JS-001-2012
JEDEC JESD22-C101E
JEDEC JESD22-A115-A
–65
Bus Pins
All Pins
All Pins
–0.5
–0.5
–0.5
MAX
6
VCC1 + 0.5
VCC2 + 0.5
±20
±100
±8
±4
±1.5
±200
150
150
UNIT
V
V
V
mA
mA
kV
kV
V
°C
°C
Maximum junction temperature
(2)
Stresses beyond those listed under ABSOLUTE MAXIMUM RATINGS cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under RECOMMENDED
OPERATING CONDITIONS is not implied. Exposure to absolute-maximum-rated conditions for extended periods affects device
reliability.
All voltage values here within are with respect to the local ground terminal (GND1 or GND2) and are peak voltage values.
THERMAL INFORMATION
THERMAL METRIC
θ
JA
θ
JCtop
θ
JB
ψ
JT
ψ
JB
θ
JCbot
(1)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
(1)
ISO1540
ISO1541
D (8 PINS)
114.6
69.6
55.3
27.2
54.7
n/a
UNITS
°C/W
For more information about traditional and new thermal metrics, see the
IC Package Thermal Metrics
application report,
RECOMMENDED OPERATING CONDITIONS
MIN
VCC1, VCC2
V
SDA1
, V
SCL1
V
SDA2
, V
SCL2
V
IL1
V
IH1
V
IL2
V
IH2
I
OL1
I
OL2
C
b1
C
b2
f
MAX
T
A
T
J
T
SD
Supply Voltage
Input/Output Signal Voltages, Side 1
Input/Output Signal Voltages, Side 2
Low-Level Input Voltage, Side 1
High-Level Input Voltage, Side 1
Low-Level Input Voltage, Side 2
High-Level Input Voltage, Side 2
Output Current, Side 1
Output Current, Side 2
Maximum Capacitive Load, Side 1
Maximum Capacitive Load, Side 2
Maximum Operating Frequency
Ambient Temperature
Junction Temperature
Thermal Shutdown
(1)
NOM
MAX
5.5
VCC1
VCC2
0.5
VCC1
0.3 x VCC2
VCC2
3.5
UNIT
3
0
0
0
0.7 x VCC1
0
0.7 x VCC2
0.5
0.5
V
mA
35
40
pF
400
1
–40
–40
139
125
136
171
MHz
°C
°C
°C
(1)
This represents the maximum frequency with the maximum bus load (C
b
) and the maximum current sink (I
O
). If the system has less bus
capacitance, then higher frequencies can be achieved.
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