INA240-Q1
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ZHCSH56E –AUGUST 2016 –REVISED DECEMBER 2021
内容
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 修订历史记录.....................................................................2
5 器件比较............................................................................ 3
6 引脚配置和功能................................................................. 3
7 规格................................................................................... 4
7.1 绝对最大额定值...........................................................4
7.2 ESD 额定值.................................................................4
7.3 建议运行条件.............................................................. 4
7.4 热性能信息..................................................................4
7.5 电气特性......................................................................5
7.6 典型特性......................................................................8
8 详细说明.......................................................................... 12
8.1 概述...........................................................................12
8.2 功能方框图................................................................12
8.3 特性说明....................................................................12
8.4 器件功能模式............................................................ 14
9 应用和实现.......................................................................19
9.1 应用信息....................................................................19
9.2 典型应用....................................................................21
9.3 必做事项和禁止事项..................................................24
10 电源相关建议.................................................................24
10.1 电源去耦..................................................................24
11 布局................................................................................25
11.1 布局指南..................................................................25
11.2 布局示例..................................................................25
12 器件和文档支持............................................................. 27
12.1 文档支持..................................................................27
12.2 接收文档更新通知................................................... 27
12.3 支持资源..................................................................27
12.4 商标.........................................................................27
12.5 Electrostatic Discharge Caution..............................27
12.6 术语表..................................................................... 27
13 机械、封装和可订购信息...............................................27
4 修订历史记录
注：以前版本的页码可能与当前版本的页码不同
Changes from Revision D (April 2020) to Revision E (December 2021)
Page
• 将“器件信息”表中的SOIC 封装尺寸从4.00mm × 3.91mm 更改为4.90mm × 3.91mm.................................1
• 在“引脚功能”表中添加了NC 引脚或保持未连接状态.................................................................................... 3
• 更改了相关文档部分中的参考设计指南链接..................................................................................................... 27
Changes from Revision C (November 2018) to Revision D (April 2020)
Page
• 添加了“提供功能安全型”信息......................................................................................................................... 1
Changes from Revision B (December 2017) to Revision C (November 2018)
Page
• 将文档状态从“混合状态”更改为“量产数据”................................................................................................ 1
• 向数据表添加了温度等级0 器件.........................................................................................................................1
• 将TSSOP 封装状态从预发布更改为量产数据....................................................................................................1
• 删除了引脚配置和功能部分中8 引脚TSSOP 封装引脚排列图中的封装预览说明..............................................3
• 删除了热性能信息表中的封装预览说明...............................................................................................................4
Changes from Revision A (December 2016) to Revision B (December 2017)
Page
• 将文档状态从“产品预发布”更改为“混合状态”.............................................................................................1
• 添加了说明（续） 部分.......................................................................................................................................1
• 向8 引脚TSSOP 封装添加了预发布标签...........................................................................................................1
• 更改了图7-15 中的y 轴值..................................................................................................................................8
• 添加了图11-2 ...................................................................................................................................................25
Changes from Revision * (August 2016) to Revision A (December 2016)
Page
• 为INA240-Q1 0 级和1 级器件添加了8 引脚D (SOIC) 封装............................................................................. 1
• 在热性能信息表中添加了D (SOIC) 封装的热性能值.......................................................................................... 4
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