PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
DS14C88M
DS14C88M/NOPB
DS14C88MX
DS14C88MX/NOPB
DS14C88N
DS14C88N/NOPB
Status
(1)
Package Type Package Pins Package
Drawing
Qty
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
D
D
D
D
NFF
NFF
14
14
14
14
14
14
55
55
2500
2500
25
25
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
Device Marking
(4/5)
Samples
NRND
ACTIVE
NRND
ACTIVE
NRND
ACTIVE
TBD
Green (RoHS
& no Sb/Br)
TBD
Green (RoHS
& no Sb/Br)
TBD
Green (RoHS
& no Sb/Br)
Call TI
CU SN
Call TI
SN | CU SN
Call TI
SN | CU SN
Call TI
Level-1-260C-UNLIM
Call TI
Level-1-260C-UNLIM
Call TI
Level-1-NA-UNLIM
DS14C88M
DS14C88M
DS14C88M
DS14C88M
DS14C88N
DS14C88N
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
for the latest availability
information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(4)
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
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