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SLES256 – MAY 2010
PACKAGE HEAT DISSIPATION RATINGS
PARAMETER
R
qJC
, junction-to-case (power pad / heat slug)
thermal resistance
R
qJA
, junction-to-ambient thermal resistance
Exposed power pad / heat slug area
DRV8312
1.1 °C/W
DRV8332
0.9 °C/W
This device is not intended to be used
without a heatsink. Therefore, R
qJA
is not
specified. See the
Thermal Information
section.
80 mm
2
25 °C/W
34 mm
2
PACKAGE POWER DERATINGS (DRV8312)
(1)
PACKAGE
44-PIN TSSOP (DDW)
(1)
Based on EVM board layout
T
A
= 25°C
POWER
RATING
5.0 W
DERATING
FACTOR
ABOVE T
A
=
25°C
40.0 mW/°C
T
A
= 70°C POWER
RATING
3.2 W
T
A
= 85°C POWER
RATING
2.6 W
T
A
= 125°C POWER
RATING
1.0 W
MODE SELECTION PINS
MODE PINS
M3
1
1
0
1
M2
0
0
x
1
M1
0
1
x
x
OUTPUT
CONFIGURATION
1 3PH or 3 HB
1 3PH or 3 HB
DESCRIPTION
Three-phase or three half bridges with cycle-by-cycle current limit
Three-phase or three half bridges with OC latching shutdown (no
cycle-by-cycle current limit)
Reserved
Reserved
Copyright © 2010, Texas Instruments Incorporated
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