PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
PDIP
Drawing
7702301EA
CD4518BE
ACTIVE
ACTIVE
J
16
16
1
None
Call TI
Level-NC-NC-NC
N
25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CD4518BF
CD4518BF3A
CD4518BM
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
SOIC
J
J
16
16
16
1
1
None
None
Call TI
Call TI
Level-NC-NC-NC
Level-NC-NC-NC
D
40
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4518BM96
CD4518BNSR
CD4518BPW
CD4518BPWR
CD4520BE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SO
D
16
16
16
16
16
2500
2000
90
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
NS
PW
PW
N
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
TSSOP
TSSOP
PDIP
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU Level-NC-NC-NC
2000
25
Pb-Free
(RoHS)
Pb-Free
(RoHS)
CD4520BF
CD4520BF3A
CD4520BM
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
SOIC
J
J
16
16
16
1
1
None
None
Call TI
Call TI
Level-NC-NC-NC
Level-NC-NC-NC
D
40
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4520BM96
CD4520BNSR
CD4520BPW
CD4520BPWR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SO
D
16
16
16
16
2500
2000
90
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
NS
PW
PW
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
TSSOP
TSSOP
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
2000
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
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