PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4051BM96
CD4051BM96
CD4051BNSR
CD4051BPWR
CD4052BM96
CD4052BNSR
CD4052BPWR
CD4053BM96
CD4053BNSR
CD4053BPWR
SOIC
SOIC
SO
D
D
16
16
16
16
16
16
16
16
16
16
2500
2500
2000
2000
2500
2000
2000
2500
2000
2000
346.0
333.2
346.0
346.0
333.2
346.0
346.0
333.2
346.0
346.0
346.0
345.9
346.0
346.0
345.9
346.0
346.0
345.9
346.0
346.0
33.0
28.6
33.0
29.0
28.6
33.0
29.0
28.6
33.0
29.0
NS
PW
D
TSSOP
SOIC
SO
NS
PW
D
TSSOP
SOIC
SO
NS
PW
TSSOP
Pack Materials-Page 2