PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4051BM96
CD4051BM96
CD4051BNSR
CD4051BPWR
CD4052BM96
CD4052BNSR
CD4052BPWR
CD4053BM96
CD4053BNSR
CD4053BPWR
SOIC
SOIC
SO
D
D
16
16
16
16
16
16
16
16
16
16
2500
2500
2000
2000
2500
2000
2000
2500
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
16.4
12.4
16.4
16.4
12.4
16.4
16.4
12.4
6.5
6.5
8.2
6.9
6.5
8.2
6.9
6.5
8.2
6.9
10.3
10.3
10.5
5.6
2.1
2.1
2.5
1.6
2.1
2.5
1.6
2.1
2.5
1.6
8.0
8.0
16.0
16.0
16.0
12.0
16.0
16.0
12.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
NS
PW
D
12.0
8.0
TSSOP
SOIC
SO
10.3
10.5
5.6
8.0
NS
PW
D
12.0
8.0
TSSOP
SOIC
SO
10.3
10.5
5.6
8.0
NS
PW
12.0
8.0
TSSOP
Pack Materials-Page 1