PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4020BNSR
CD4020BPWR
CD4024BM96
CD4024BMT
SO
TSSOP
SOIC
SOIC
SO
NS
PW
D
16
16
14
14
14
14
16
16
16
2000
2000
2500
250
367.0
367.0
367.0
367.0
367.0
367.0
333.2
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
345.9
367.0
367.0
38.0
35.0
38.0
38.0
38.0
35.0
28.6
38.0
35.0
D
CD4024BNSR
CD4024BPWR
CD4040BM96
CD4040BNSR
CD4040BPWR
NS
PW
D
2000
2000
2500
2000
2000
TSSOP
SOIC
SO
NS
PW
TSSOP
Pack Materials-Page 2