PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4001BM96
CD4001BMT
CD4001BNSR
CD4001BPWR
CD4002BM96
CD4002BMT
CD4002BNSR
CD4002BPWR
CD4025BM96
CD4025BMT
CD4025BNSR
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
14
14
14
14
14
2500
250
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
38.0
38.0
35.0
38.0
38.0
38.0
35.0
38.0
38.0
38.0
NS
PW
D
2000
2000
2500
250
TSSOP
SOIC
SOIC
SO
D
NS
PW
D
2000
2000
2500
250
TSSOP
SOIC
SOIC
SO
D
NS
2000
Pack Materials-Page 2