PACKAGE OUTLINE
VQFN - 1 mm max height
RGZ0048A
PLASTIC QUADFLAT PACK- NO LEAD
A
7.1
6.9
B
(0.1) TYP
7.1
6.9
SIDE WALL DETAIL
OPTIONAL METAL THICKNESS
PIN 1 INDEX AREA
(0.45) TYP
CHAMFERED LEAD
CORNER LEAD OPTION
1 MAX
C
SEATING PLANE
0.08 C
0.05
0.00
2X 5.5
5.15±0.1
(0.2) TYP
13
24
44X 0.5
12
25
SEE SIDE WALL
DETAIL
SYMM
2X
5.5
1
36
0.30
0.18
PIN1 ID
(OPTIONAL)
48X
48
37
SYMM
0.1
C A B
C
0.5
0.3
48X
0.05
SEE LEAD OPTION
4219044/D 02/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
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