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AM3352BZCZD80 参数 Datasheet PDF下载

AM3352BZCZD80图片预览
型号: AM3352BZCZD80
PDF下载: 下载PDF文件 查看货源
内容描述: 的Sitara AM335x ARM Cortex-A8的微处理器(MPU ) [Sitara AM335x ARM Cortex-A8 Microprocessors (MPUs)]
分类和应用: 微控制器和处理器外围集成电路微处理器时钟
文件页数/大小: 236 页 / 2887 K
品牌: TI [ TEXAS INSTRUMENTS ]
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AM3359, AM3358, AM3357  
AM3356, AM3354, AM3352  
SPRS717F OCTOBER 2011REVISED APRIL 2013  
www.ti.com  
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the  
package type (for example, ZCE), the temperature range (for example, blank is the default commercial  
temperature range), and the device speed range, in megahertz (for example, 27 is 275 MHz). Figure 6-1  
provides a legend for reading the complete device name for any AM335x device.  
For orderable part numbers of AM335x devices in the ZCE and ZCZ package types, see the Package  
Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.  
For additional description of the device nomenclature markings on the die, see the AM335x ARM Cortex-  
A8 Microprocessors (MPUs) Silicon Errata (literature number SPRZ360).  
(
)
X
(
)
AM3358  
B
ZCZ  
PREFIX  
DEVICE SPEED RANGE  
27 = 275-MHz Cortex-A8  
30 = 300-MHz Cortex-A8  
50 = 500-MHz Cortex-A8  
60 = 600-MHz Cortex-A8  
72 = 720-MHz Cortex-A8  
80 = 800-MHz Cortex-A8  
100 = 1-GHz Cortex-A8  
X = Experimental device  
Blank = Qualified device  
DEVICE(A)  
ARM Cortex-A8 MPU:  
AM3352  
AM3354  
AM3356  
AM3357  
AM3358  
AM3359  
TEMPERATURE RANGE  
Blank = 0°C to 90°C (commercial junction temperature)  
A = -40°C to 105°C (extended junction temperature)  
D = -40°C to 90°C (industrial junction temperature)  
DEVICE REVISION CODE  
Blank = silicon revision 1.0  
A = silicon revision 2.0  
PACKAGE TYPE(B)  
ZCE = 298-pin plastic BGA, with Pb-Free solder balls  
ZCZ = 324-pin plastic BGA, with Pb-Free solder balls  
B = silicon revision 2.1  
A. The AM3358 device shown in this device nomenclature example is one of several valid part numbers for the AM335x  
family of devices. For orderable device part numbers, see the Package Option Addendum of this document.  
B. BGA = Ball Grid Array.  
Figure 6-1. AM335x Device Nomenclature  
6.2 Documentation Support  
6.2.1 Related Documentation from Texas Instruments  
The following documents describe the AM335x MPU. Copies of these documents are available on the  
Internet at www.ti.com. Tip: Enter the literature number in the search box.  
The current documentation that describes the AM335x MPU, related peripherals, and other technical  
collateral, is available in the product folder at: www.ti.com.  
SPRUH73 AM335x ARM Cortex-A8 Microprocessors (MPUs) Technical Reference Manual.  
Collection of documents providing detailed information on the AM335x device including  
power, reset, and clock control, interrupts, memory map, and switch fabric interconnect.  
Detailed information on the microprocessor unit (MPU) subsystem as well as a functional  
description of the peripherals supported on AM335x devices is also included.  
SPRZ360  
AM335x ARM Cortex-A8 Microprocessors (MPUs) Silicon Errata. Describes the known  
exceptions to the functional specifications for the AM335x ARM Cortex-A8 Microprocessors.  
6.2.2 Community Resources  
The following links connect to TI community resources. Linked contents are provided "AS IS" by the  
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;  
see TI's Terms of Use.  
TI E2E Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration  
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and  
help solve problems with fellow engineers.  
TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help  
226  
Device and Documentation Support  
Copyright © 2011–2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352  
 
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