PACKAGE OPTION ADDENDUM
www.ti.com
8-Jan-2010
Orderable Device
AM26LS32AIDRG4
AM26LS32AIN
AM26LS32AINE4
AM26LS32AMFKB
AM26LS32AMJ
AM26LS32AMJB
AM26LS32AMWB
AM26LS33ACD
AM26LS33ACDE4
AM26LS33ACDG4
AM26LS33ACDR
AM26LS33ACDRE4
AM26LS33ACDRG4
AM26LS33ACN
AM26LS33ACNE4
AM26LS33AMFKB
AM26LS33AMJ
AM26LS33AMJB
AM26LS33AMWB
(1)
Status
(1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SOIC
PDIP
PDIP
LCCC
CDIP
CDIP
CFP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
LCCC
CDIP
CDIP
CFP
Package
Drawing
D
N
N
FK
J
J
W
D
D
D
D
D
D
N
N
FK
J
J
W
Pins Package Eco Plan
(2)
Qty
16
16
16
20
16
16
16
16
16
16
16
16
16
16
16
20
16
16
16
2500 Green (RoHS &
no Sb/Br)
25
25
1
1
1
1
40
40
40
Pb-Free
(RoHS)
Pb-Free
(RoHS)
TBD
TBD
TBD
TBD
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
CU NIPDAU
CU NIPDAU
CU NIPDAU
MSL Peak Temp
(3)
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
POST-PLATE N / A for Pkg Type
A42
A42
A42
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
25
25
1
1
1
1
Pb-Free
(RoHS)
Pb-Free
(RoHS)
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 2
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