PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Orderable Device
AM26LS31CNE4
AM26LS31CNSR
AM26LS31CNSRG4
AM26LS31MFKB
Status
(1)
Package Type Package Pins Package
Drawing
Qty
PDIP
SO
SO
LCCC
N
NS
NS
FK
16
16
16
20
25
2000
2000
1
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
0 to 70
0 to 70
0 to 70
-55 to 125
Device Marking
(4/5)
Samples
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Pb-Free
(RoHS)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
CU NIPDAU
CU NIPDAU
CU NIPDAU
POST-PLATE
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
AM26LS31CN
26LS31
26LS31
5962-
7802301M2A
AM26LS31
MFKB
5962-7802301ME
A
AM26LS31MJB
5962-7802301MF
A
AM26LS31MWB
AM26LS31MJB
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
AM26LS31MWB
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
for the latest availability
information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(4)
Addendum-Page 2
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