PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
Orderable Device
AM26LS31CNSR
AM26LS31CNSRG4
AM26LS31MFKB
Status
(1)
Package Type Package Pins Package Qty
Drawing
SO
SO
LCCC
NS
NS
FK
16
16
20
2000
2000
1
Eco Plan
(2)
Lead/Ball Finish
CU NIPDAU
CU NIPDAU
POST-PLATE
MSL Peak Temp
(3)
Op Temp (°C)
0 to 70
0 to 70
-55 to 125
Top-Side Markings
(4)
Samples
ACTIVE
ACTIVE
ACTIVE
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
26LS31
26LS31
5962-
7802301M2A
AM26LS31
MFKB
5962-7802301ME
A
AM26LS31MJB
5962-7802301MF
A
AM26LS31MWB
AM26LS31MJB
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
AM26LS31MWB
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
for the latest availability
information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Only one of markings shown within the brackets will appear on the physical device.
(4)
Important Information and Disclaimer:The
information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 2
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