PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ADC0834CCWMX/NOPB
ACTIVE
SOIC
NPA
14
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
ADC0834
CCWM
ADC0838CCN
ACTIVE
ACTIVE
PDIP
PDIP
NFH
NFH
20
20
18
18
TBD
Call TI
SN
Call TI
-40 to 85
-40 to 85
ADC0838CCN
ADC0838CCN/NOPB
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
ADC0838CCN
ADC0838CCWM
ADC0838CCWM/NOPB
ADC0838CCWMX
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
DW
DW
DW
DW
DW
DW
DW
20
20
20
20
20
20
20
36
36
TBD
Call TI
CU SN
Call TI
CU SN
CU SN
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
ADC0838
CCWM
Green (RoHS
& no Sb/Br)
Level-3-260C-168 HR
Call TI
ADC0838
CCWM
1000
1000
36
TBD
ADC0838
CCWM
ADC0838CCWMX/NOPB
ADC0838CIWM/NOPB
ADC0838CIWMX
Green (RoHS
& no Sb/Br)
Level-3-260C-168 HR
Level-3-260C-168 HR
Call TI
ADC0838
CCWM
Green (RoHS
& no Sb/Br)
ADC0838
CIWM
1000
1000
TBD
ADC0838
CIWM
ADC0838CIWMX/NOPB
Green (RoHS
& no Sb/Br)
Level-3-260C-168 HR
ADC0838
CIWM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 2
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