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74HC164 参数 Datasheet PDF下载

74HC164图片预览
型号: 74HC164
PDF下载: 下载PDF文件 查看货源
内容描述: 8位并行输出串行移位寄存器 [8-BIT PARALLEL-OUT SERIAL SHIFT REGISTERS]
分类和应用: 移位寄存器
文件页数/大小: 14 页 / 347 K
品牌: TI [ TEXAS INSTRUMENTS ]
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SN54HC164, SN74HC164
8-BIT PARALLEL-OUT SERIAL SHIFT REGISTERS
SCLS115D – DECEMBER 1982 – REVISED AUGUST 2003
typical clear, shift, and clear sequence
CLR
Serial Inputs
A
B
CLK
QA
QB
QC
Outputs
QD
QE
QF
QG
QH
Clear
Clear
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
CC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input clamp current, I
IK
(V
I
< 0 or V
I
> V
CC
) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±20
mA
Output clamp current, I
OK
(V
O
< 0 or V
O
> V
CC
) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±20
mA
Continuous output current, I
O
(V
O
= 0 to V
CC
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±25
mA
Continuous current through V
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±50
mA
Package thermal impedance,
θ
JA
(see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, T
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
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