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78M6612-IMR/F/P 参数 Datasheet PDF下载

78M6612-IMR/F/P图片预览
型号: 78M6612-IMR/F/P
PDF下载: 下载PDF文件 查看货源
内容描述: 单相,双插座电源和电能计量IC [Single-Phase, Dual-Outlet Power and Energy Measurement IC]
分类和应用: 插座
文件页数/大小: 111 页 / 1528 K
品牌: TERIDIAN [ TERIDIAN SEMICONDUCTOR CORPORATION ]
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78M6612 Data Sheet  
DS_6612_001  
Revision History  
Revision Date  
Description  
1.0  
1.1  
4/1/2009  
5/6/2009  
First publication.  
Replaced Figure 39 with improved performance data.  
Miscellaneous editorial corrections.  
1.2  
6/11/2009 In Section 4.4.1, changed “CE6612_OMU_S2_A01_V1_0” to  
“CE6612_OMU_S2_A01_V1_2”.  
In Section 4.4.6, changed “I0_SHUNT” to “I1_SHUNT” and “I1_SHUNT” to  
I2_SHUNT”. Also changed “W0SUM_X” to “W1SUM_X” and “W1SUM_X” to  
W2SUM_X”.  
In Section 4.4.7.1, changed “W0SUM_X” to “W1SUM_X” and “W1SUM_X” to  
W2SUM_X”. Also changed “VAR0SUM_X” to “VAR1SUM_X” and  
VAR1SUM_X” to “VAR2SUM_X”.  
In Section 4.4.7.2, changed “I0SQSUM_X” to “I1SQSUM_X” and “I1SQSUM_X”  
to “I2SQSUM_X”. Changed the CE Address of WSUM_ACCUM from “0x7D” to  
“0x1B”. Added CE Address 0x7C, V3SQSUM_X. Deleted CE Address 0x7E,  
VSUM_ACCUM.  
In Section 4.4.7.3, changed the CE Address for GAIN_ADJ from 0x18 to  
0x19.  
In Section 4.4.7.6, changed “element 0” to “element 1” and “element 1” to  
“element 2”. Changed “element A” to “element 1” and “element B” to  
“element 2”. Also changed “I0SQSUM” to “I1SQSUM” and “I1SQSUM” to  
I2SQSUM”.  
In Figure 43, changed pin 65 from “PB” to “GNDD”.  
In Section 7.3, changed “CKOUT_EN” to “CKOUT_E[1:0]”.  
© 2009 Teridian Semiconductor Corporation. All rights reserved.  
Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation.  
Simplifying System Integration is a trademark of Teridian Semiconductor Corporation.  
MicroDAA is a registered trademark of Teridian Semiconductor Corporation.  
All other trademarks are the property of their respective owners.  
Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly  
contained in the Company’s warranty detailed in the Teridian Semiconductor Corporation standard Terms  
and Conditions. The company assumes no responsibility for any errors which may appear in this  
document, reserves the right to change devices or specifications detailed herein at any time without  
notice and does not make any commitment to update the information contained herein. Accordingly, the  
reader is cautioned to verify that this document is current by comparing it to the latest version on  
http://www.teridian.com or by checking with your sales representative.  
110  
Rev. 1.2