DS_8009C_025
73S8009C Data Sheet
Revision History
Revision
1.0
Date
Description
2/15/2007
12/5/2007
First publication.
1.1
Replaced 32 QFN punched with SAWN.
Updated 32QFN package mark.
1.2
1.3
1/21/2008
8/28/2009
Changed the dimension of the bottom view 32-pin QFN package.
Added Pin Current, LIN to Table 2.
Added Section 2.7, Thermal Characteristics.
Added a note to the end of Section 3.6.
Added Section 4, Equivalent Circuits.
Added Section 7 Related Documentation and Section 8 Contact Information
section.
Formatted to new documentation style. Miscellaneous editorial changes.
1.4
1/5/2010
Changed the name of the “ON/OFF” pin to “ON_OFF” throughout the
document.
In Figure 1, corrected the name of the “IOUC” pin to “I/OUC”.
In Table 1, corrected the OFF_ACK name, pin number and type information.
In Table 7, changed “IDDmax” to “IVPmax”.
At the end of Section 3.3, added a note about using VBUS input.
In Section 3.5, deleted “A voltage supervisor checks the value of the voltage
VCC” and added “and 40 mA for 1.8 V cards”.
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All other trademarks are the property of their respective owners.
Simplifying System Integration is a trademark of Teridian Semiconductor Corporation.
This Data Sheet is proprietary to Teridian Semiconductor Corporation (TSC) and sets forth design goals
for the described product. The data sheet is subject to change. TSC assumes no obligation regarding
future manufacture, unless agreed to in writing. If and when manufactured and sold, this product is sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement and limitation of liability. Teridian Semiconductor Corporation
(TSC) reserves the right to make changes in specifications at any time without notice. Accordingly, the
reader is cautioned to verify that a data sheet is current before placing orders. TSC assumes no liability
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Rev. 1.4
33
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