73M1903 Data Sheet
DS_1903_032
Revision History
Rev. #
1.0
Date
Comments
4/16/2004
12/13/2004
7/15/2005
9/14/2006
9/14/2006
5/23/2007
12/14/2007
First publication.
1.1
Minor modification for format.
Company logo change and minor modification for format.
Corrected QFN pin-out drawing.
Corrected QFN pin-out drawing.
Added 20-VT package information.
1.2
1.3
1.4
1.5
1.6
Changed 32-QFN from punched to SAWN.
Removed the leaded package option.
1.7
2.0
1/17/2008
2/23/2009
Changed the bottom view package dimension for 32-QFN package.
Removed all references to the 32-pin TQFP package.
Formatted to the new corporate standard.
© 2009 Teridian Semiconductor Corporation. All rights reserved.
Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation.
Simplifying System Integration is a trademark of Teridian Semiconductor Corporation.
MicroDAA is a registered trademark of Teridian Semiconductor Corporation.
All other trademarks are the property of their respective owners.
Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly
contained in the Company’s warranty detailed in the Teridian Semiconductor Corporation standard Terms
and Conditions. The company assumes no responsibility for any errors which may appear in this
document, reserves the right to change devices or specifications detailed herein at any time without
notice and does not make any commitment to update the information contained herein. Accordingly, the
reader is cautioned to verify that this document is current by comparing it to the latest version on
http://www.teridian.com or by checking with your sales representative.
Teridian Semiconductor Corp., 6440 Oak Canyon, Suite 100, Irvine, CA 92618
TEL (714) 508-8800, FAX (714) 508-8877, http://www.teridian.com
46
Rev. 2.0
TERIDIAN [ TERIDIAN SEMICONDUCTOR CORPORATION ]
