73K224BL
V.22bis, V.22, V.21, Bell 212A, 103
Single-Chip Modem w/ Integrated Hybrid
DATA SHEET
ELECTRICAL SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
VDD supply voltage
Storage temperature
Soldering temperature (10 s)
Applied voltage
7 V
-65 to 150° C
235° C
-0.3 to VDD + 0.3 V
NOTE: All inputs and outputs are protected from static charge using built-in, industry standard protection
devices and all outputs are short-circuit protected.
RECOMMENDED OPERATING CONDITIONS
PARAMETER
CONDITION
MIN
4.5
NOM
MAX
5.5
UNIT
V
VDD supply voltage
TA, operating free-air
Clock variation
5
-40
+85
C
(11.0592 MHz) crystal or external
clock
-0.01
+0.01
%
External components (Refer to application section for placement.)
VREF bypass capacitor
Bias setting resistor
External to GND (Note 1)
0.1
1.8
µF
Placed between VDD and ISET
pins
2
2.2
Ω
ISET bypass capacitor
VDD bypass capacitor 1
VDD bypass capacitor 2
XTL1 load capacitor
ISET pin to GND
0.1
0.1
22
µF
µF
µF
pF
External to GND (Note 1)
External to GND (Note 1)
Depends on crystal characteristics
from pin to GND
40
40
XTL2 load capacitor
Depends on crystal characteristics
from pin to GND
pF
Hybrid loading
see Figure 1
600
600
Ω
Ω
R1
R2
C1
0.033
Ω
µF
NOTE 1: Minimum for optimized system layout; may require higher values for noisy environments.
Page: 21 of 33
© 2005, 2008 TERIDIAN Semiconductor Corporation
Rev 7.1
TERIDIAN [ TERIDIAN SEMICONDUCTOR CORPORATION ]
