FDS_6533_6534_004
71M6533/71M6534 Data Sheet
5.2 Recommended External Components
Table 63: Recommended External Components
To Function
AGND Bypass capacitor for 3.3 V supply
Name
C1
From
V3P3A
V3P3D
V3P3SYS
V2P5
Value
Unit
µF
≥0.1 ±20% †
≥0.1 ±20% †
≥1.0 ±30%
0.1 ±20%
32.768
C2
DGND
DGND
DGND
XOUT
Bypass capacitor for 3.3 V output
Bypass capacitor for V3P3SYS
Bypass capacitor for V2P5
µF
CSYS
C2P5
XTAL
µF
µF
kHz
XIN
32.768 kHz crystal – electrically similar to
ECS .327-12.5-17X or Vishay XT26T,
load capacitance 12.5 pF
CXS
CXL
XIN
AGND
AGND
Load capacitor for crystal (depends on
crystal specs and board parasitics).
pF
pF
33 ±10%
15 ±10%
XOUT
Load capacitor for crystal (depends on
crystal specs and board parasitics).
Notes:
1. AGND and DGND should be connected together.
2. V3P3SYS and V3P3A should be connected together.
3. † For accuracy and EMI rejection, C1 + C2 should be 470 µF or higher.
5.3 Recommended Operating Conditions
Table 64: Recommended Operating Conditions
Parameter
Condition
Normal Operation
Battery Backup
Min
3.0
0
Typ
3.3
Max
3.6
Unit
V
V3P3SYS, V3P3A: 3.3 V Supply Voltage
V3P3A and V3P3SYS must be at the
same voltage
3.6
V
VBAT
No Battery
Externally Connect to V3P3SYS
Battery Backup:
BRN and LCD mod-
es
3.0
3.8
V
2.0
-40
3.8
V
SLEEP mode
Operating Temperature
+85
ºC
v1.1
© 2007-2009 TERIDIAN Semiconductor Corporation
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