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5962-8986301YX 参数 Datasheet PDF下载

5962-8986301YX图片预览
型号: 5962-8986301YX
PDF下载: 下载PDF文件 查看货源
内容描述: [FIFO, 512X9, 80ns, Asynchronous, CMOS, 1.485 X 0.310 INCH, 0.230 INCH HIEGHT, DIP-28]
分类和应用: 先进先出芯片
文件页数/大小: 22 页 / 225 K
品牌: TEMIC [ TEMIC SEMICONDUCTORS ]
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3.7 Certificate of conformance. A certificate of conformance as required in MIL-STD-883 (see 3.1 herein) shall be  
provided with each lot of microcircuits delivered to this drawing.  
3.8 Notification of change. Notification of change to DESC-ECC shall be required in accordance with MIL-STD-883  
(see 3.1 herein).  
3.9 Verification and review. DESC, DESC's agent, and the acquiring activity retain the option to review the  
manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore  
at the option of the reviewer.  
4. QUALITY ASSURANCE PROVISIONS  
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with section 4 of  
MIL-M-38510 to the extent specified in MIL-STD-883 (see 3.1 herein).  
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all  
devices prior to quality conformance inspection. The following additional criteria shall apply:  
a. Burn-in test, method 1015 of MIL-STD-883.  
(1) Test condition A, B, C, or D using the circuit submitted with the certificate of compliance (see 3.6 herein).  
(2) T = +125 C, minimum.  
A
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical  
parameter tests prior to burn-in are optional at the discretion of the manufacturer.  
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of  
MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply.  
4.3.1 Group A inspection.  
a. Tests shall be as specified in table II herein.  
b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.  
c. Subgroup 4 (C and C  
IN  
measurements) shall be measured only for the initial test and after process or design  
OUT  
changes which may affect input capacitance. Sample size is 15 devices with no failures, and all input  
and output terminals tested.  
d. Subgroups 7 and 8 shall include verification of the truth table.  
4.3.2 Groups C and D inspections.  
a. End-point electrical parameters shall be as specified in table II herein.  
b. Steady-state life test conditions, method 1005 of MIL-STD-883.  
(1) Test condition D or E using the circuit submitted with the certificate of compliance (see 3.6 herein).  
(2) T = +125 C, minimum.  
A
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.  
SIZE  
STANDARDIZED  
5962-89863  
A
MILITARY DRAWING  
DEFENSE ELECTRONICS SUPPLY CENTER  
DAYTON, OHIO 45444  
REVISION LEVEL  
SHEET  
19  
DESC FORM 193A  
SEP 87  
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