DU W307
SAW Duplexer – CDMA450 Block A – 5x5
December 6th, 2005
Preliminary Specification (Rev. 4)
Recommended Reflow Profiles
Lead Process (Sn/Pb)
Typical reflow temperature for this profile is 240 °C of profile :
Example of profile :
Note : Reflow profile to use depends on solder characteristics. Each soldering material supplier has its own recommendation. This
profile is use for the product qualification step.
Lead Free Process :
Typical reflow temperature for this profile is 250 to 260 °C
Example of profile :
Note : Reflow profile to use depends on solder characteristics. Each soldering material supplier has its own recommendation.
TEMEX use the above temperature profile to test reflow compliance of products. Usually the temperature peak is around
250-260 °C during 10 to 20 secondes.
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TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
TEMEX [ TEMEX ]
