SILICON PIN DIODES
Plastic package Surface Mount attenuating silicon PIN diodes
P LASTIC PACKAGE S URFACE MOUNT ATTENUATING
S ILICON P IN DIODES
Description
TEMEX uses its proprietary technology to m anufacture its Silicon PIN diodes in plastic package.
This product fam ily is designed for a low cost, m edium to high volum e m arket that m ay be supplied
in tape and reel for autom ated pick and place assem bly on surface m ount circuit boards.
The use of this technology elim inates wire bonding on to the chips.
Applications
Typical applications include variable RF attenuators and AGC (Autom atic Gain Control) circuits,
from MHz to several GHz.
The attenuating Pin diode uses properties of variation of forward series resistance versus the DC
forward bias current. In order to obtain the best dynam ic range, a single diode attenuator m ay be used
in series or shunt configuration or designed as a m ultiple diode circuit (T or p circuit), where the device
m ay be m atched through the attenuation range.
Note:To reduce the distortion, it is necessary to verify and design with the following form ula:
Î
HF
πτl I
F
DC
<< 1
Î
:
:
:
:
RF peak current (A)
HF
τl
Diode m inority carrier lifetim e (s)
DC bias current (A)
I
DC
F
Application frequency (Hz)
Typical perform ance curve
Typical series resistance versus forward current
RSF (Ω)
1000
100
10
1
DH40144
DH40225
DH40141
IF (mA)
10
0.1
1
12-8
Vol. 1
SALES OFFICES : VIS IT OUR WEB S ITE AT
h tt p ://w w w .t e m ex.n e t
TEMEX [ TEMEX ]
