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S2008V12V 参数 Datasheet PDF下载

S2008V12V图片预览
型号: S2008V12V
PDF下载: 下载PDF文件 查看货源
内容描述: 晶闸管产品目录 [Thyristor Product Catalog]
分类和应用:
文件页数/大小: 224 页 / 2673 K
品牌: TECCOR [ TECCOR ELECTRONICS ]
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Electrical Parameter Terminology  
tgt (Gate-controlled Turn-on Time) – Time interval between  
the 10% rise of the gate pulse and the 90% rise of the principal  
current pulse during switching of a thyristor from the off state to  
the on state  
Thyristor  
di/dt (Critical Rate-of-rise of On-state Current) – Maximum  
value of the rate-of-rise of on-state current which a thyristor can  
withstand without deleterious effect  
tq (Circuit-commutated Turn-off Time) – Time interval  
between the instant when the principal current has decreased to  
zero after external switching of the principal voltage circuit and  
the instant when the SCR is capable of supporting a specified  
principal voltage without turning on  
dv/dt (Critical Rate-of-rise of Off-state Voltage or Static  
dv/dt) – Minimum value of the rate-of-rise of principal voltage  
which will cause switching from the off state to the on state  
dv/dt(c) Critical Rate-of-rise of Commutation Voltage of a  
Triac (Commutating dv/dt) – Minimum value of the rate-of-rise  
of principal voltage which will cause switching from the off state  
to the on state immediately following on-state current conduction  
in the opposite quadrant  
VBO (Breakover Voltage) – Principal voltage at the breakover  
point  
VDRM (Repetitive Peak Off-state Voltage) – Maximum allow-  
able instantaneous value of repetitive off-state voltage that may  
be applied across a bidirectional thyristor (forward or reverse  
direction) or SCR (forward direction only)  
I2t (RMS Surge (Non-repetitive) On-state Fusing Current) –  
Measure of let-through energy in terms of current and time for  
fusing purposes  
VGT (Gate Trigger Voltage) – Minimum gate voltage required to  
produce the gate trigger current  
IBO (Breakover Current) – Principal current at the breakover  
point  
VRRM (Repetitive Peak Reverse Voltage) – Maximum allow-  
able instantaneous value of a repetitive reverse voltage that may  
be applied across an SCR without causing reverse current ava-  
lanche  
IDRM (Repetitive Peak Off-state Current) – Maximum leakage  
current that may occur under the conditions of VDRM  
IGT (Gate Trigger Current) – Minimum gate current required to  
VS (Switching Voltage) – Voltage point after VBO when a sidac  
switch a thyristor from the off state to the on state  
switches from a clamping state to on state  
IH (Holding Current) – Minimum principal current required to  
VT (On-state Voltage) – Principal voltage when the thyristor is in  
maintain the thyristor in the on state  
the on state  
IPP (Peak Pulse Current) – Peak pulse current at a short time  
duration and specified waveshape  
Diode Rectifiers  
IRRM (Repetitive Peak Reverse Current) – Maximum leakage  
IF(AV) (Average Forward Current) – Average forward conduc-  
current that may occur under the conditions of VRRM  
tion current  
IS (Switching Current) – Current at VS when a sidac switches  
IFM (Maximum (Peak) Reverse Current) – Maximum reverse  
from the clamping state to on state  
leakage current that may occur at rated VRRM  
IT(RMS) (On-state Current) – Anode cathode principal current  
that may be allowed under stated conditions, usually the full-  
cycle RMS current  
IF(RMS) (RMS Forward Current) – RMS forward conduction cur-  
rent  
IFSM (Maximum (Peak) Forward (Non-repetitive) Surge  
ITSM (Surge (Non-repetitive) On-state Current) – Peak single  
Current) – Maximum (peak) forward single cycle AC surge cur-  
cycle AC current pulse allowed  
rent allowed for specified duration  
PG(AV) (Average Gate Power Dissipation) – Value of gate  
power which may be dissipated between the gate and main ter-  
minal 1 (or cathode) average over a full cycle  
VFM (Maximum (Peak) Forward Voltage Drop) – Maximum  
(peak) forward voltage drop from the anode to cathode at stated  
conditions  
PGM (Peak Gate Power Dissipation) – Maximum power which  
may be dissipated between the gate and main terminal 1 (or  
cathode) for a specified time duration  
VR (Reverse Blocking Voltage) – Maximum allowable DC  
reverse blocking voltage that may be applied to the rectifier  
VRRM (Maximum (Peak) Repetitive Reverse Voltage) – Maxi-  
mum peak allowable value of a repetitive reverse voltage that  
may be applied to the rectifier  
R
θJA (Thermal Resistance, Junction-to-ambient) – Tempera-  
ture difference between the thyristor junction and ambient divided  
by the power dissipation causing the temperature difference  
under conditions of thermal equilibrium  
Note: Ambient is defined as the point where temperature does  
not change as a result of the dissipation.  
R
θJC (Thermal Resistance, Junction-to-case) – Temperature  
difference between the thyristor junction and the thyristor case  
divided by the power dissipation causing the temperature differ-  
ence under conditions of thermal equilibrium  
©2002 Teccor Electronics  
Thyristor Product Catalog  
E0 - 3  
http://www.teccor.com  
+1 972-580-7777  
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