Quality and Reliability
Reliability Stress Tests
The following table contains brief descriptions of the reliability tests commonly used in evaluating Teccor product reliability on a peri-
odic basis. These tests are applied across product lines depending on product availability and test equipment capacities. Other tests
may be performed when appropriate.
Test Type
Typical Conditions
Test Description
Standards
T = 100 °C to 150 °C, Bias @
Evaluation of the reliability of
product under bias conditions
and elevated temperature
MIL-STD-750, M-1040
High Temperature
A
AC Blocking
100%
Rated VDRM, t = 24 hrs to 1000 hrs
TA = 150 °C, t = 250 to 1000 hrs Evaluation of the effects on
devices after long periods of
MIL-STD-750, M-1031
High Temperature
Storage Life
storage at high temperature
TA = 85 °C to 95 °C, rh = 85% to Evaluation of the reliability of non- EIA / JEDEC, JESD22-A101
Temperature and Humidity
Bias Life
hermetic packaged devices in
95%
humid environments
Bias @ 80% Rated V
(320 VDC max)
DRM
t = 168 to 1008 hrs
TA = -65 °C to 150 °C,
cycles = 10 to 500
Evaluation of the device’s ability MIL-STD-750, M-1051,
Temperature Cycle
[Air to Air]
to withstand the exposure to
extreme temperatures and the
forces of TCE during transitions
between temperatures
EIA / JEDEC, JESD22-A104
TA = 0 °C to 100 °C, ttxfr = ≤10 s, Evaluation of the device’s ability MIL-STD-750, M-1056
Thermal Shock
to withstand the sudden changes
cycled = 10 to 20
[Liquid to Liquid]
in temperature and exposure to
extreme temperatures
TA = 121 °C, rh = 100%, P = 15 psig, Accelerated environmental test to EIA / JEDEC, JESD22-A102
Autoclave
evaluate the moisture resistance
t = 24 hrs to 168 hrs
of plastic packages
TA = 260 °C, t = 10 s
Evaluation of the device’s ability MIL-STD-750, M-2031
to withstand the temperatures as
seen in wave soldering
Resistance to
Solder Heat
operations
Steam aging = 1 hr to 8 hrs,
Evaluation of the solderability of MIL-STD-750, M-2026,
Solderability
T
= 245 °C, Flux = R
device terminals after an
extended period
ANSI-J-STD-002
solder
Flammability Test
For the UL 94V0 flammability test, all expoxies used in Teccor encapsulated devices are recognized by Underwriters Laboratories
©2002 Teccor Electronics
Thyristor Product Catalog
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